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| Titre : |
Advanced interconnects for ULSI technology |
| Type de document : |
texte imprimé |
| Auteurs : |
Mikhail R. Baklanov ; Paul S. Ho ; Ehrenfried Zschech |
| Editeur : |
Chichester : John Wiley & Sons |
| Année de publication : |
2012 |
| Importance : |
579 p. |
| Présentation : |
couv. ill. en coul., ill. en noir et blanc |
| Format : |
25 cm |
| ISBN/ISSN/EAN : |
978-0-470-66254-0 |
| Note générale : |
Biblogr. Index |
| Langues : |
Anglais (eng) |
| Tags : |
Interconnects (integrated circuit technology) Integrated circuits-Ultra large scale integration |
| Index. décimale : |
621.39 Génie informatique |
| Résumé : |
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: •Interconnect functions, characterisations, electrical properties and wiring requirements. •Low-k materials: fundamentals, advances and mechanical properties. •Conductive layers and barriers. •Integration and reliability. including mechanical reliability, electromigration and electrical breakdown. •New approaches including 3D, optical, wireless interchip, and carbon-based interconnects. Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. |
Advanced interconnects for ULSI technology [texte imprimé] / Mikhail R. Baklanov ; Paul S. Ho ; Ehrenfried Zschech . - Chichester : John Wiley & Sons, 2012 . - 579 p. : couv. ill. en coul., ill. en noir et blanc ; 25 cm. ISBN : 978-0-470-66254-0 Biblogr. Index Langues : Anglais ( eng)
| Tags : |
Interconnects (integrated circuit technology) Integrated circuits-Ultra large scale integration |
| Index. décimale : |
621.39 Génie informatique |
| Résumé : |
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: •Interconnect functions, characterisations, electrical properties and wiring requirements. •Low-k materials: fundamentals, advances and mechanical properties. •Conductive layers and barriers. •Integration and reliability. including mechanical reliability, electromigration and electrical breakdown. •New approaches including 3D, optical, wireless interchip, and carbon-based interconnects. Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. |
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